A semiconductor device equipped with secondary pads having adequate arrangement for an arbitrary packaging process. The secondary pads are connected with the primary pads of the semiconductor device with a novel lead wire structure, which is characterized by its low electric resistance, good mechanical...http://www.google.es/patents/US6232147?utm_source=gb-gplus-sharePatente US6232147 - Method for manufacturing semiconductor device with pad structure
Method for manufacturing semiconductor device with pad structure
