A method of depositing a premetal dielectric layer involves deposition of a triple premetal dielectric layer in in-situ deposition in a single fabrication tool with each subsequent layer being deposited after a previous layer with no intervening handling step. Thus, no intervening cleaning steps or other...http://www.google.es/patents/US6127261?utm_source=gb-gplus-sharePatente US6127261 - Method of fabricating an integrated circuit including a tri-layer pre-metal interlayer dielectric compatible with advanced CMOS technologies
Method of fabricating an integrated circuit including a tri-layer pre-metal ...
