A method of processing a semiconductive material wafer includes, a) providing a semiconductive material wafer having integrated circuitry fabricated within discrete die areas on the wafer, the discrete die areas having bond pads formed therewithin; b) cutting at least partially into the semiconductive...http://www.google.es/patents/US5863813?utm_source=gb-gplus-sharePatente US5863813 - Method of processing semiconductive material wafers and method of forming flip chips and semiconductor chips
Method of processing semiconductive material wafers and method of forming ...
