A method of forming solder connections on a circuitized substrate having connection pads is provided. A laser ablatable solder mask material, preferably an epoxy, is degassed and then dispensed as a liquid onto the substrate over the circuitization. The surface of the solder mask material as applied...http://www.google.es/patents/US6708871?utm_source=gb-gplus-sharePatente US6708871 - Method for forming solder connections on a circuitized substrate
Method for forming solder connections on a circuitized substrate
