A transfer metal configuration and fabrication process possessing increased probability of intersecting a transverse metallization level are presented, without employing an increase in actual metal thickness. The transfer metal is configured with a non-rectangular transverse ...http://www.google.es/patents/US5691239?utm_source=gb-gplus-sharePatente US5691239 - Method for fabricating an electrical connect above an integrated circuit
Method for fabricating an electrical connect above an integrated circuit
