A semiconductor wafer, liquid interface clamping and cooling system 80 includes a chuck 10 having clamping section 12 with a top surface 16 with three clamping/cooling circuit grooves machined therein for providing a liquid interface between a wafer under test and the top surface 16. A bottom surface...http://www.google.es/patents/US5088006?utm_source=gb-gplus-sharePatente US5088006 - Liquid film interface cooling system for semiconductor wafer processing
Liquid film interface cooling system for semiconductor wafer processing
