In a process for fabricating planarized thin film metal interconnects for integrated circuit structures, a planarized metal layer is etched back to the underlying dielectric layer by electropolishing, ion milling or other procedure. Electropolishing reduces processing time from hours to minutes and allows...http://www.google.es/patents/US5256565?utm_source=gb-gplus-sharePatente US5256565 - Electrochemical planarization
