An embodiment of the instant invention is a method of forming a conductive barrier layer on a dielectric layer, the method comprising the steps of: providing the dielectric layer (112 of FIG. 7d) having a top surface, a bottom surface, and an opening extending from the top surface to the bottom surface,...http://www.google.es/patents/US6576546?utm_source=gb-gplus-sharePatente US6576546 - Method of enhancing adhesion of a conductive barrier layer to an underlying conductive plug and contact for ferroelectric applications
Method of enhancing adhesion of a conductive barrier layer to an underlying ...
