The invention provides a via with improved resistance to failures due to delamination voids. In one embodiment, the via may extend from above to below a bottom conductor and include an anchor section. The anchor section may mechanically interlock the via with the bottom conductor to prevent the via from...http://www.google.es/patents/US20050085067?utm_source=gb-gplus-sharePatente US20050085067 - Robust interlocking via
Número de solicitud: 10/917,140 Número de publicación: US 2005/0085067 A1 Fecha de presentación: 11 Ago 2004 Patente emitida: US6946737 ( Fecha de emisión 20 Sep 2005)
