The present invention relates to a cold plate for cooling electronic components comprising a base having a top surface onto which at least one electronic component is to be placed; a cooling well formed in the top of the base and open at the top; a feed channel formed in the base for carrying fluid into...http://www.google.es/patents/US6434003?utm_source=gb-gplus-sharePatente US6434003 - Liquid-cooled power semiconductor device heatsink
