A packaging technique for electronic devices includes wafer fabrication of contacts on the bottom surface of the substrate underneath the active circuit. Inherently reliable contacts suitable for a variety of devices can be formed, via a simple fabrication process, with good wafer packing density. In...http://www.google.es/patents/US5910687?utm_source=gb-gplus-sharePatente US5910687 - Wafer fabrication of die-bottom contacts for electronic devices
Wafer fabrication of die-bottom contacts for electronic devices
