A multi-chip memory module may be formed including two or more stacked integrated circuits mounted to a substrate or lead frame structure. The memory module may include means to couple one or more of the stacked integrated circuits to edge conductors in a memory card package configuration. Such means...http://www.google.es/patents/US20030155659?utm_source=gb-gplus-sharePatente US20030155659 - Memory module having interconnected and stacked integrated circuits
Memory module having interconnected and stacked integrated circuits
Número de solicitud: 10/080,036 Número de publicación: US 2003/0155659 A1 Fecha de presentación: 19 Feb 2002 Patente emitida: US6731011 ( Fecha de emisión 4 May 2004)
