In a resin molded semiconductor device, a metal lead frame includes an island and leads, and the leads have bulged terminal portions. Also, a semiconductor chip is mounted on the island, and external terminals are adhered to the bulged terminal portions opposite to the semiconductor chip. Further, an...http://www.google.es/patents/US5982026?utm_source=gb-gplus-sharePatente US5982026 - Inexpensive resin molded semiconductor device
