Methods of de-fluorinating a wafer surface after damascene processing and prior to photoresist removal are disclosed, as is a related structure. In one embodiment, the method places the wafer surface in a chamber and exposes the wafer surface to a plasma from a source gas including at least one of nitrogen...http://www.google.es/patents/US7049209?utm_source=gb-gplus-sharePatente US7049209 - De-fluorination of wafer surface and related structure
De-fluorination of wafer surface and related structure
