The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer,...http://www.google.es/patents/US5251806?utm_source=gb-gplus-sharePatente US5251806 - Method of forming dual height solder interconnections
Method of forming dual height solder interconnections
