In one embodiment, an integrated circuit (IC) fabrication material is dispensed from a print head by dividing its nozzles into several groups, and sequentially allowing each group to fire. The nozzles may be grouped based on the amounts of material they dispense. For example, the nozzles may be grouped...http://www.google.es/patents/US7091134?utm_source=gb-gplus-sharePatente US7091134 - Deposition of integrated circuit fabrication materials using a print head
Deposition of integrated circuit fabrication materials using a print head
