In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the mounting substrate, the flux paste includes a base flux and metal grains having diameters smaller than the...http://www.google.es/patents/US20020185309?utm_source=gb-gplus-sharePatente US20020185309 - Method for mounting electronic part and paste material
Method for mounting electronic part and paste material
Número de solicitud: 10/084,370 Número de publicación: US 2002/0185309 A1 Fecha de presentación: 28 Feb 2002 Patente emitida: US6796025 ( Fecha de emisión 28 Sep 2004)