In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes...http://www.google.es/patents/US7432590?utm_source=gb-gplus-sharePatente US7432590 - Ceramic package, assembled substrate, and manufacturing method therefor
Ceramic package, assembled substrate, and manufacturing method therefor
