A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation material in the package body. A plurality...http://www.google.es/patents/US6853059?utm_source=gb-gplus-sharePatente US6853059 - Semiconductor package having improved adhesiveness and ground bonding
Semiconductor package having improved adhesiveness and ground bonding
