The invention provides a via with improved resistance to failures due to delamination voids. In one embodiment, the via may extend from above to below a bottom conductor and include an anchor section. The anchor section may mechanically interlock the via with the bottom conductor to prevent the via from...http://www.google.es/patents/US6946737?utm_source=gb-gplus-sharePatente US6946737 - Robust interlocking via
