A semiconductor-chip is bonded to a chip-carrier substrate by way of a gold-to-gold bonding interface. A vacuum chuck is provided to physically hold the semiconductor-chip in physical contact with, the chip-carrier substrate as static force, ultrasonic power, and an elevated temperature are applied...http://www.google.es/patents/US6169330?utm_source=gb-gplus-sharePatente US6169330 - Method and apparatus for packaging high temperature solid state electronic devices
Method and apparatus for packaging high temperature solid state electronic ...
