A vacuum deposition chamber alternately receives a reactive gas and an inert gas during a process in which a thin film is formed on a wafer in the chamber. The inert gas flows through a first pressure regulator, a first feed line and a first changeover valve into the chamber. The reactive gas flows through...http://www.google.es/patents/US5488967?utm_source=gb-gplus-sharePatente US5488967 - Method and apparatus for feeding gas into a chamber
Method and apparatus for feeding gas into a chamber
