A technique for forming an organic chip carrier or circuit board, having two voltage planes and at least two signal planes is provided which includes bonding a first layer of photolithographic dielectric material to a first metal layer and exposing the first layer of dielectric material to a pattern...http://www.google.es/patents/US6201194?utm_source=gb-gplus-sharePatente US6201194 - Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric
Multi-voltage plane, multi-signal plane circuit card with photoimageable ...
