The present invention is provided with a transmission line element having a ground wiring and a power supply wiring formed interposing an insulating film, on the power supply wiring on a semiconductor chip, lead or printed-circuit board, such that the capacitance per unit length of the transmission line...http://www.google.es/patents/US7288844?utm_source=gb-gplus-sharePatente US7288844 - Semiconductor device, semiconductor circuit and method for producing semiconductor device
Semiconductor device, semiconductor circuit and method for producing ...