Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die attachment may...http://www.google.es/patents/US6967113?utm_source=gb-gplus-sharePatente US6967113 - Method for in-line testing of flip-chip semiconductor assemblies
Method for in-line testing of flip-chip semiconductor assemblies
