A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body...http://www.google.es/patents/US7656047?utm_source=gb-gplus-sharePatente US7656047 - Semiconductor device package and manufacturing method
Semiconductor device package and manufacturing method
