A semiconductor package assembly is disclosed having a semiconductor die receiving member configured to accept a semiconductor die in either the flip-chip or the wirebond orientations. First contact sites on a die receiving surface provide electrical connection with a flip-chip component. Second contact...http://www.google.es/patents/US6331221?utm_source=gb-gplus-sharePatente US6331221 - Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
Process for providing electrical connection between a semiconductor die and ...
