According to the present invention, individual two-dimensional barcodes 30, 91 and 173 are provided for individual chips 31 arrayed on a wafer 50, individual lead fames 93 to each of which chips 92 are bonded and individual packaged products 171 constituted of resin sealed semiconductor chips based upon...http://www.google.es/patents/US7137557?utm_source=gb-gplus-sharePatente US7137557 - Semiconductor device and an information management system therefore
Semiconductor device and an information management system therefore
