A method for forming a flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area...http://www.google.es/patents/US6998290?utm_source=gb-gplus-sharePatente US6998290 - Economical high density chip carrier
