A plurality of semiconductor chips are mounted on a plurality of islands formed on a lead frame. Inner lead portions of the lead frame and electrode pads formed on the semiconductor chips are electrically connected to one another via first lead portions formed on a flexible resin tape and the electrode...http://www.google.es/patents/US5245215?utm_source=gb-gplus-sharePatente US5245215 - Multichip packaged semiconductor device and method for manufacturing the same
Multichip packaged semiconductor device and method for manufacturing the same
