A heat dissipating system for cooling circuit chips or modules is described. The disclosed system includes circuit chips or modules which are vertically mounted, a gas at an elevated pressure being contained within an encased module for providing an enhanced thermal coupling between the chips or modules...http://www.google.es/patents/US4449580?utm_source=gb-gplus-sharePatente US4449580 - Vertical wall elevated pressure heat dissipation system
Vertical wall elevated pressure heat dissipation system
