A micro-electro-mechanical system (MEMS) package having a metal sealing member is disclosed. The MEMS package is formed by forming a metal layer on a substrate by patterning so that the metal layer surrounds an MEMS element provided on the substrate; joining a lid to the metal layer; providing a side...http://www.google.es/patents/US20060076670?utm_source=gb-gplus-sharePatente US20060076670 - Micro-electro-mechanical system (MEMS) package having metal sealing member
Micro-electro-mechanical system (MEMS) package having metal sealing member
Número de solicitud: 11/180,308 Número de publicación: US 2006/0076670 A1 Fecha de presentación: 12 Jul 2005 Patente emitida: US7368816 ( Fecha de emisión 6 May 2008)
