The present invention provides a method of forming an integrated semiconductor device, and the device so formed. An active surface of at least two semiconductor devices, such as semiconductor chips, are temporarily mounted onto an alignment substrate. A support substrate is affixed to a back surface...http://www.google.es/patents/US6963132?utm_source=gb-gplus-sharePatente US6963132 - Integrated semiconductor device having co-planar device surfaces
Integrated semiconductor device having co-planar device surfaces
