Polymerized materials for forming the underfill and encapsulation structures for semiconductor package are disclosed. A filler constituent, such as boron nitride, silicates, elemental metals, or alloys, may be added to a liquid photopolymer resin to tailor the physical properties thereof upon curing....http://www.google.es/patents/US7547978?utm_source=gb-gplus-sharePatente US7547978 - Underfill and encapsulation of semiconductor assemblies with materials having differing properties
Underfill and encapsulation of semiconductor assemblies with materials ...
