A silicon carbide structure (10) and method capable of using existing silicon wafer fabrication facilities. A silicon wafer (20) is provided which has a first diameter. At least one silicon carbide wafer (30) is provided which has a given width and length (or diameter). The width and length (or diameter)...http://www.google.es/patents/US5349207?utm_source=gb-gplus-sharePatente US5349207 - Silicon carbide wafer bonded to a silicon wafer
