A method is provided for fabricating a multilayer printed circuit board, including embedded electrically conductive elements formed as part of the fabrication of the layers of the printed circuit board. An insulating layer and a conductive layer are then pressed over the electrically conductive elements...http://www.google.es/patents/US7631423?utm_source=gb-gplus-sharePatente US7631423 - Method and process for embedding electrically conductive elements in a dielectric layer
Method and process for embedding electrically conductive elements in a ...
