An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The flexible substrate is also attached to the second substrate via a resin. When the assembly is manufactured, the...http://www.google.es/patents/US5976910?utm_source=gb-gplus-sharePatente US5976910 - Electronic device assembly and a manufacturing method of the same
Electronic device assembly and a manufacturing method of the same
