A solid state device or circuit mounted or printed on a heat conductive ceramic substrate such as beryllia is brought into thermal conductive relation with a metal heat dissipation plate as by clamping with no intervening materials such as an adhesive or solder therebetween....http://www.google.es/patents/US4069497?utm_source=gb-gplus-sharePatente US4069497 - High heat dissipation mounting for solid state devices and circuits
High heat dissipation mounting for solid state devices and circuits
