A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip...http://www.google.es/patents/US6531337?utm_source=gb-gplus-sharePatente US6531337 - Method of manufacturing a semiconductor structure having stacked semiconductor devices
Method of manufacturing a semiconductor structure having stacked ...
