A non-impact form of thermocompression gang bonding of metal lead fingers to integrated circuit chip pads is disclosed. The method produces a plurality of simultaneously bonded chips using conventional heating means and totally avoids mechanical and thermal shock. The result is highly reliable bonding...http://www.google.es/patents/US4607779?utm_source=gb-gplus-sharePatente US4607779 - Non-impact thermocompression gang bonding method
