Flip chip packages and methods for producing a flip chip package by prepackaging one or more dice on a semiconductor wafer. The package, in one embodiment, includes an adhesive layer applied to an active side of the wafer. The adhesive layer has openings to permit access to the conductive pads on each...http://www.google.es/patents/US6710454?utm_source=gb-gplus-sharePatente US6710454 - Adhesive layer for an electronic apparatus having multiple semiconductor devices
Adhesive layer for an electronic apparatus having multiple semiconductor devices
