A dual-in-line package (DIP) for a bubble memory is achieved by mounting the bubble chip in a cantilevered position in the plane of a rigid conductor arrangement which is interconnected to a DIP base. The lead track arrangement forms a rigid support for the chip fixing the chip in a position for receiving...http://www.google.es/patents/US3996574?utm_source=gb-gplus-sharePatente US3996574 - Magnetic bubble, field-access assembly
