An interposer includes a substrate, first and second sets of contact pads carried by the substrate, and receptacles formed in a surface of the substrate and exposing contact pads of the second set. The interposer may also include conductive traces carried by the substrate to electrically connect corresponding...http://www.google.es/patents/US7145225?utm_source=gb-gplus-sharePatente US7145225 - Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
Interposer configured to reduce the profiles of semiconductor device ...
