A package with two or more stacked semiconductor chips and a method of manufacturing the same. In the method, an upper semiconductor chip package and a lower semiconductor chip package are prepared. Solder balls are formed on a substrate of the lower package to connect the upper and lower packages. A...http://www.google.es/patents/US20050012195?utm_source=gb-gplus-sharePatente US20050012195 - BGA package with stacked semiconductor chips and method of manufacturing the same
BGA package with stacked semiconductor chips and method of manufacturing the ...
Número de solicitud: 10/850,154 Número de publicación: US 2005/0012195 A1 Fecha de presentación: 21 May 2004 Patente emitida: US7262080 ( Fecha de emisión 28 Ago 2007)
