A semiconductor wafer rework process sideways etches an underlying layer of metal to remove a difficult to etch upper layer of metal without substantially etching that upper layer and without damaging permanent layers of the wafer. If the underlying layer of metal is TiW and the permanent layer is aluminum,...http://www.google.es/patents/US6332988?utm_source=gb-gplus-sharePatente US6332988 - Rework process
