A semiconductor package includes a semiconductor die having a circuit side and a back side, a multi layered leadframe attached to the die, a dense array of terminal contacts in electrical communication with the die, and a plastic body encapsulating the die and the leadframe. The leadframe includes circuit...http://www.google.es/patents/US6784525?utm_source=gb-gplus-sharePatente US6784525 - Semiconductor component having multi layered leadframe
Semiconductor component having multi layered leadframe
