A method of providing a hermetically sealed enclosure for a highly moisture sensitive electronic device including depositing an electrical conductor on the substrate which provides an electrical connection with the electronic device and depositing an electrically insulating thin layer over the electrical...http://www.google.es/patents/US20020187254?utm_source=gb-gplus-sharePatente US20020187254 - Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays
Ultrasonically sealing the cover plate to provide a hermetic enclosure for ...
Número de solicitud: 09/850,788 Número de publicación: US 2002/0187254 A1 Fecha de presentación: 8 May 2001 Patente emitida: US6706316 ( Fecha de emisión 16 Mar 2004)
