A semiconductor device having a thinned semiconductor element allowed to be easily handled, and a method of manufacturing the device are provided. The semiconductor device includes a semiconductor element and a bumper member bonded, as a reinforcing member, to a back surface opposite to an electrode-formed...http://www.google.es/patents/US20020048906?utm_source=gb-gplus-sharePatente US20020048906 - Semiconductor device, method of manufacturing the device and mehtod of mounting the device
Semiconductor device, method of manufacturing the device and mehtod of ...
Número de solicitud: 09/977,220 Número de publicación: US 2002/0048906 A1 Fecha de presentación: 16 Oct 2001 Patente emitida: US6797544 ( Fecha de emisión 28 Sep 2004)
