The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where...http://www.google.es/patents/US7692926?utm_source=gb-gplus-sharePatente US7692926 - Integrated thermal systems
