A semiconductor chip assembly includes a semiconductor chip, a conductive trace, an insulative adhesive and a hardened connection joint. The conductive trace includes first and second opposing surfaces and a peripheral sidewall between the surfaces, the first surface faces away from the pad and the peripheral...http://www.google.es/patents/US6548393?utm_source=gb-gplus-sharePatente US6548393 - Semiconductor chip assembly with hardened connection joint
Semiconductor chip assembly with hardened connection joint
